We developed a Proper Orthogonal Decomposition (POD) based dynamic reduced order model that can predict transient temperature field in an air-cooled data center. A typical data center is modeled as a turbulent convective thermal system with multiple length scales. A representative case study is presented to validate the developed methodology. The model is observed to be capable of predicting the transient air temperature field accurately and rapidly. Comparing with the computational fluid mechanics/heat transfer (CFD/HT) based model, it is revealed that our model is 100x faster without compromising solution accuracy. The developed modeling framework is potentially useful for designing a control system that can regulate flow parameters in a transient data center.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4462-5
PROCEEDINGS PAPER
Dynamic Reduced Order Thermal Modeling of Data Center Air Temperatures
Rajat Ghosh,
Rajat Ghosh
Georgia Institute of Technology, Atlanta, GA
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Yogendra Joshi
Yogendra Joshi
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Rajat Ghosh
Georgia Institute of Technology, Atlanta, GA
Yogendra Joshi
Georgia Institute of Technology, Atlanta, GA
Paper No:
IPACK2011-52029, pp. 423-432; 10 pages
Published Online:
February 14, 2012
Citation
Ghosh, R, & Joshi, Y. "Dynamic Reduced Order Thermal Modeling of Data Center Air Temperatures." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2. Portland, Oregon, USA. July 6–8, 2011. pp. 423-432. ASME. https://doi.org/10.1115/IPACK2011-52029
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