Power on chip is highly temperature dependent in deep sub-micron VLSI. With increasing power density in modern 3D-IC and SiP, thermal induced reliability and performance issues such as leakage power and electromigration must be taken into consideration in the system level design. This paper presents a new methodology and its applications to accurately and efficiently predict power and temperature distribution for 3D ICs.

Volume Subject Area:
Thermal Management
Topics:
Design, Electrodiffusion, Leakage, Power density, Reliability, Temperature, Temperature distribution
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Copyright © 2011
 by ASME
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