Passive heat transfer from enclosures with rectangular fins is studied both experimentally and theoretically. Several sample enclosures with various lengths are prepared and tested. To calibrate the thermal measurements and the analyses, enclosures without fins (“bare” enclosures) are also prepared and tested. Surface temperature distribution is determined for various enclosure lengths and heat generation rates. Existing relationships for natural convection and radiation heat transfer are used to calculate the heat transfer rate of the tested samples. The theoretical results successfully predict the trends observed in the experimental data. It is observed that the contribution of the radiation heat transfer is on the order of 50% of the total heat transfer for the tested enclosures. As such, a new correlation is reported for calculating optimum fin spacing in uniformly finned surfaces, with rectangular straight fins, that takes into account both natural convection and radiation.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4462-5
PROCEEDINGS PAPER
Assessment of Thermal Performance of Electronic Enclosures With Rectangular Fins: A Passive Thermal Solution Available to Purchase
A. Tamayol,
A. Tamayol
Simon Fraser University, Surrey, BC, Canada
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F. McGregor,
F. McGregor
Simon Fraser University, Surrey, BC, Canada
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E. Demian,
E. Demian
Analytic Systems Ware Ltd., Delta, BC, Canada
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E. Trandafir,
E. Trandafir
Analytic Systems Ware Ltd., Delta, BC, Canada
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P. Bowler,
P. Bowler
Analytic Systems Ware Ltd., Delta, BC, Canada
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P. Rada,
P. Rada
Analytic Systems Ware Ltd., Delta, BC, Canada
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M. Bahrami
M. Bahrami
Simon Fraser University, Surrey, BC, Canada
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A. Tamayol
Simon Fraser University, Surrey, BC, Canada
F. McGregor
Simon Fraser University, Surrey, BC, Canada
E. Demian
Analytic Systems Ware Ltd., Delta, BC, Canada
E. Trandafir
Analytic Systems Ware Ltd., Delta, BC, Canada
P. Bowler
Analytic Systems Ware Ltd., Delta, BC, Canada
P. Rada
Analytic Systems Ware Ltd., Delta, BC, Canada
M. Bahrami
Simon Fraser University, Surrey, BC, Canada
Paper No:
IPACK2011-52174, pp. 269-276; 8 pages
Published Online:
February 14, 2012
Citation
Tamayol, A, McGregor, F, Demian, E, Trandafir, E, Bowler, P, Rada, P, & Bahrami, M. "Assessment of Thermal Performance of Electronic Enclosures With Rectangular Fins: A Passive Thermal Solution." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2. Portland, Oregon, USA. July 6–8, 2011. pp. 269-276. ASME. https://doi.org/10.1115/IPACK2011-52174
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