The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for determining the internal forces and deformations of wires when subjected to an external pull force, (2) the determination of the maximum pull force (when the wire breaks) based on some failure criteria of the wires; and (3) the experimental verification of the present equations.
- Electronic and Photonic Packaging Division
A Note on the Reliability of Cu/Au Wire Interconnects
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Lau, J, Wu, S, & Lau, JM. "A Note on the Reliability of Cu/Au Wire Interconnects." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 83-89. ASME. https://doi.org/10.1115/IPACK2011-52286
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