The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for determining the internal forces and deformations of wires when subjected to an external pull force, (2) the determination of the maximum pull force (when the wire breaks) based on some failure criteria of the wires; and (3) the experimental verification of the present equations.

Volume Subject Area:
Advanced Packaging
Topics:
Reliability, Wire, Copper, Deformation, Displacement, Failure, Microelectronic devices, Structural mechanics
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Copyright © 2011
 by ASME
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