Large-scale public cloud commodity computing is a potential paradigm-shifter for EDA tools. However, to go beyond merely web-hosted software and to exploit the true power of on-demand scalable computing is as yet an unmet challenge on many fronts. In this paper, we examine one computationally expensive and rapidly growing area within EDA as a candidate for the cloud, namely parasitic extraction and electromagnetic field simulation. With the growing emphasis on multifunctional systems in consumer electronics around commodity chips, the need for scale and speed in such tools is paramount. We examine from three aspects the suitability of and modifications needed to accelerated multilevel algorithms in boundary element methods in order to ensure cloud deployment: scalability without hitting Amdahl’s law prematurely, fault tolerance with low time penalties in realistic computing systems, and encryption-free approaches to ensuring IP security.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Cloud-Based Scalable Parallel Electromagnetic Tools for Full-System Simulation Available to Purchase
Vikram Jandhyala,
Vikram Jandhyala
University of Washington, Seattle, WA
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Dipanjan Gope,
Dipanjan Gope
Physware, Inc., Mountainview, CA
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Swagato Chakraborty,
Swagato Chakraborty
Physware, Inc., Bellevue, WA
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Xiren Wang
Xiren Wang
Physware, Inc., Bellevue, WA
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Vikram Jandhyala
University of Washington, Seattle, WA
Dipanjan Gope
Physware, Inc., Mountainview, CA
Swagato Chakraborty
Physware, Inc., Bellevue, WA
Xiren Wang
Physware, Inc., Bellevue, WA
Paper No:
IPACK2011-52280, pp. 663-669; 7 pages
Published Online:
February 14, 2012
Citation
Jandhyala, V, Gope, D, Chakraborty, S, & Wang, X. "Cloud-Based Scalable Parallel Electromagnetic Tools for Full-System Simulation." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 663-669. ASME. https://doi.org/10.1115/IPACK2011-52280
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