This paper describes an accurate and efficient analysis methodology that enables circuit optimization directly guided by platform-level metric such as link eye margin. Prior to this work, such analysis was not feasible due to significant compute time required by complex circuit simulations. A new method of developing highly abstracted behavioral models of complex circuit blocks is a critical element of this analysis methodology. The method uses statistical signaling analysis and optimization capabilities coupled with behavioral modeling of I/O clocking, transmitter and receiver circuitry that are based on accurate circuit simulations. We also present measured data from products and test chips that show correlation between measured and modeled data within 10–15%. Finally, we describe how the methodology was used to optimize the design of a high speed serial link and achieve approximately 70% improvement in eye margins with limited design iterations.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
An Accurate and Efficient Link Analysis Methodology for High Speed I/O Design
Mohiuddin Mazumder,
Mohiuddin Mazumder
Intel Corporation, Santa Clara, CA
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James Jaussi,
James Jaussi
Intel Corporation, Hillsboro, OR
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Sitaraman Iyer,
Sitaraman Iyer
Intel Corporation, Santa Clara, CA
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Fulvio Spagna,
Fulvio Spagna
Intel Corporation, Santa Clara, CA
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Beomtaek Lee,
Beomtaek Lee
Intel Corporation, Santa Clara, CA
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Arvind Kumar
Arvind Kumar
Intel Corporation, Hudson, MA
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Mohiuddin Mazumder
Intel Corporation, Santa Clara, CA
James Jaussi
Intel Corporation, Hillsboro, OR
Sitaraman Iyer
Intel Corporation, Santa Clara, CA
Fulvio Spagna
Intel Corporation, Santa Clara, CA
Zuoguo Wu
Intel Corporation, Santa Clara, CA
Beomtaek Lee
Intel Corporation, Santa Clara, CA
Arvind Kumar
Intel Corporation, Hudson, MA
Paper No:
IPACK2011-52279, pp. 653-661; 9 pages
Published Online:
February 14, 2012
Citation
Mazumder, M, Jaussi, J, Iyer, S, Spagna, F, Wu, Z, Lee, B, & Kumar, A. "An Accurate and Efficient Link Analysis Methodology for High Speed I/O Design." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 653-661. ASME. https://doi.org/10.1115/IPACK2011-52279
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