The need for better high frequency performance, improved I/O power decoupling, and introduction of multi-chip processors are just some of the drivers for developing embedded capacitor technologies. One new technology, the Thin Film Embedded Package Capacitor (TFC) can target an improvement in the high frequency performance of the microprocessor power delivery network. Using this technology prototype packages for an Intel Microprocessor were fabricated and the impedance of the power delivery network (PDN) measured. The packages with the embedded TFCs demonstrated a reduction by more than a factor of 2 in the high frequency power delivery network impedance, and correspondingly improved voltage droop.

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