The significant roles of Cu-filled TSV passive interposers for 3D IC integration are investigated in this study. Emphasis is placed on the roles they play as: (1) substrates; (2) carriers; (3) thermal management tools; and (4) reliability buffers. It is shown that the Cu-filled TSV passive interposers are the most cost-effective integrator for 3D IC integration system-in-package (SiP).

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