Multi-walled Carbon nanotube (MWCNT) has a great tolerance to electromigration (EM). Therefore, MWCNT is expected to be applied to via-material of electronic devices. But, the damage mechanism of MWCNT has not yet been revealed though oxidation by Joule heating and the EM by high density electron flow are proposed as causes of the MWCNT damage under high current density. In this study, we performed acceleration tests of MWCNT to reveal the damage mechanism of MWCNT under high current density. As a result of the acceleration test, lifetime in low vacuum condition with a low oxygen concentration was longer than that in the air. And, local evaporation of carbon due to oxidation appeared near the cathode end of CNT under both conditions. We confirmed presence of two mechanisms of CNT damage; oxidation and EM. It was shown that the oxidation mechanism at the damage site due to EM was enhanced under oxygen rich condition.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density
Kazuhiko Sasagawa,
Kazuhiko Sasagawa
Hirosaki University, Hirosaki, Aomori, Japan
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Jun Unuma,
Jun Unuma
Hirosaki University, Hirosaki, Aomori, Japan
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Takehiro Abo
Takehiro Abo
Hirosaki University, Hirosaki, Aomori, Japan
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Kazuhiko Sasagawa
Hirosaki University, Hirosaki, Aomori, Japan
Jun Unuma
Hirosaki University, Hirosaki, Aomori, Japan
Takehiro Abo
Hirosaki University, Hirosaki, Aomori, Japan
Paper No:
IPACK2011-52169, pp. 487-491; 5 pages
Published Online:
February 14, 2012
Citation
Sasagawa, K, Unuma, J, & Abo, T. "Effect of Oxygen Concentration on Damage Mechanism of Carbon Nanotubes Under High Current Density." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 487-491. ASME. https://doi.org/10.1115/IPACK2011-52169
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