Mechanical evaluation method of adhesive strength for bonding IC chips in chip-stacked packages is investigated. These film adhesives are required to bond IC chips securely under JEDEC moisture/reflow test. The stress condition of film adhesives under the moisture/reflow test is analyzed by FEM to clarify proper stress condition for the adhesive test. Thermal strain, moisture expansion and strain induced by vapor pressure is considered. It is found that the shear stress is the main loading factor on reflow process in the analysis. A shear test using chevron-shaped chip is proposed as the adhesive test, which apply shear load to the film adhesive at the corner of a chip. The specimen is fabricated by the same process of actual semiconductor manufacturing. The evaluation method is conducted without any problem. The proposed method is thought to be suitable for film adhesives of chip bonding.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition Available to Purchase
Naoya Saiki,
Naoya Saiki
Tokyo Institute of Technology, Tokyo, Japan
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Kazuaki Inaba,
Kazuaki Inaba
Tokyo Institute of Technology, Tokyo, Japan
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Kikuo Kishimoto,
Kikuo Kishimoto
Tokyo Institute of Technology, Tokyo, Japan
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Hideo Senoo
Hideo Senoo
Lintec Corporation, Saitama, Japan
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Naoya Saiki
Tokyo Institute of Technology, Tokyo, Japan
Kazuaki Inaba
Tokyo Institute of Technology, Tokyo, Japan
Kikuo Kishimoto
Tokyo Institute of Technology, Tokyo, Japan
Hideo Senoo
Lintec Corporation, Saitama, Japan
Paper No:
IPACK2011-52096, pp. 473-478; 6 pages
Published Online:
February 14, 2012
Citation
Saiki, N, Inaba, K, Kishimoto, K, & Senoo, H. "Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 473-478. ASME. https://doi.org/10.1115/IPACK2011-52096
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