An ionic polymer-metal composite (IPMC) consisting of a thin perfuorinated ionomer membrane, electrodes plated on both faces, undergoes large bending motion when a small electric field is applied across its thickness in a hydrated state. On the other hand, when small load is applied on IPMC, the electric field is induced in the polymer membrane depending on the magnitude of loading. The characteristics of IPMC are ease of miniaturization, low density and mechanical flexibility. Therefore, it is considered to have a wide range of applications from MEMS sensors to actuators. In this paper, we developed the fabrication process of IPMC actuator with palladium electrodes, which have lower stiffness than the conventional IPMC actuator with Au or Pt electrodes. The deformation of IPMC actuator is evaluated under various solvents, various temperatures, and various frequencies of input voltages. We developed the numerical model of IPMC actuator that can change the solution temperature and the ion species and compared the simulation results to the experimental results.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor
Hiroki Yanamori,
Hiroki Yanamori
Keio University, Yokohama, Kanagawa, Japan
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Takuma Kobayashi,
Takuma Kobayashi
Keio University, Yokohama, Kanagawa, Japan
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Masaki Omiya
Masaki Omiya
Keio University, Yokohama, Kanagawa, Japan
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Hiroki Yanamori
Keio University, Yokohama, Kanagawa, Japan
Takuma Kobayashi
Keio University, Yokohama, Kanagawa, Japan
Masaki Omiya
Keio University, Yokohama, Kanagawa, Japan
Paper No:
IPACK2011-52259, pp. 417-424; 8 pages
Published Online:
February 14, 2012
Citation
Yanamori, H, Kobayashi, T, & Omiya, M. "Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 417-424. ASME. https://doi.org/10.1115/IPACK2011-52259
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