The fracture and fatigue behaviors of polysilicon thin film structures with arbitrary shapes were formulated by taking the stress distribution into account. The parameters appearing in both Weibull distribution and Paris’ law that describe the static strength and fatigue behaviors, respectively, are estimated using the maximum likelihood method on the basis of the results of tensile static fracture and fatigue tests performed on two types of polysilicon thin film specimens with different shapes fabricated using the same conditions. The difference between the fatigue lifetime distributions between the two types was well explained by applying the formula with a unique set of parameters. These results suggest that the fracture and fatigue behaviors of polysilicon thin films have a unique characteristics regardless of stress distributions.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films
Vu Le Huy,
Vu Le Huy
Nagoya Institute of Technology, Nagoya, Aichi, Japan
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Joao Gaspar,
Joao Gaspar
University of Freiburg, Freiburg, Germany
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Oliver Paul,
Oliver Paul
University of Freiburg, Freiburg, Germany
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Shoji Kamiya
Shoji Kamiya
Nagoya Institute of Technology, Nagoya, Aichi, Japan
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Vu Le Huy
Nagoya Institute of Technology, Nagoya, Aichi, Japan
Joao Gaspar
University of Freiburg, Freiburg, Germany
Oliver Paul
University of Freiburg, Freiburg, Germany
Shoji Kamiya
Nagoya Institute of Technology, Nagoya, Aichi, Japan
Paper No:
IPACK2011-52250, pp. 409-415; 7 pages
Published Online:
February 14, 2012
Citation
Huy, VL, Gaspar, J, Paul, O, & Kamiya, S. "Estimation of the Parameters Determining Strength and Fatigue Behaviors of Arbitrarily-Shaped Polysilicon Thin Films." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 409-415. ASME. https://doi.org/10.1115/IPACK2011-52250
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