This paper presents the design, fabrication, and experimental results of a multiple-beam tuning-fork gyroscope (MB-TFG). Based on a numerical model of thermoelastic damping, a multiple-beam tuning-fork structure is designed with high Quality factors (Qs) in its two operation modes. A simple mask that defines the device through trenches is employed to implement this MB-TFG design on silicon-on-insulator wafers. The highest measured Qs of the fabricated MB-TFGs in vacuum are 255,000 in the drive-mode and 103,000 in the sense-mode, at a frequency of 15.7kHz. Under a frequency difference of 4Hz between the two modes (operation frequency is 16.8kHz) and a drive-mode vibration amplitude of 3.0μm, the measured rate sensitivity is 80μVPP/°/s with an equivalent impedance of 2.5MΩ. The calculated overall rate resolution of this device is 0.377hr°/√Hz.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Design and Implementation of a Multiple-Beam Tuning-Fork Gyroscope Available to Purchase
Peng Cheng,
Peng Cheng
Old Dominion University, Norfolk, VA
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Darrin Young
Darrin Young
University of Utah, Salt Lake City, UT
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Ren Wang
Old Dominion University, Norfolk, VA
Peng Cheng
Old Dominion University, Norfolk, VA
Fei Xie
Old Dominion University, Norfolk, VA
Zhili Hao
Old Dominion University, Norfolk, VA
Darrin Young
University of Utah, Salt Lake City, UT
Paper No:
IPACK2011-52074, pp. 387-393; 7 pages
Published Online:
February 14, 2012
Citation
Wang, R, Cheng, P, Xie, F, Hao, Z, & Young, D. "Design and Implementation of a Multiple-Beam Tuning-Fork Gyroscope." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 387-393. ASME. https://doi.org/10.1115/IPACK2011-52074
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