Semiconductor component manufacturers supply to different product manufacturers in a wide range of market segments, for different end use applications. The goal of electronic component qualification is to demonstrate component reliability under operating conditions in the end product configuration. While a manufacturer may have successfully qualified an individual component, operating stresses due to surrounding components or the system can decrease individual component reliability. Not accounting for these operating stresses resulting from other components or the system will lead to lower life than anticipated. Using a case study, the authors demonstrate how the fatigue life of a chip component mounted on a PCB is affected by powered components on the board in close proximity.
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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions Available to Purchase
Shilin Liu,
Shilin Liu
Yokohama National University, Yokohama, Kanagawa, Japan
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Qiang Yu,
Qiang Yu
Yokohama National University, Yokohama, Kanagawa, Japan
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Michael Pecht
Michael Pecht
University of Maryland, Washington, MD
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Shilin Liu
Yokohama National University, Yokohama, Kanagawa, Japan
Qiang Yu
Yokohama National University, Yokohama, Kanagawa, Japan
Michael Pecht
University of Maryland, Washington, MD
Paper No:
IPACK2011-52111, pp. 201-205; 5 pages
Published Online:
February 14, 2012
Citation
Liu, S, Yu, Q, & Pecht, M. "Reliability Evaluation of Electronic Devices Under Considering the Actual Use Conditions." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 201-205. ASME. https://doi.org/10.1115/IPACK2011-52111
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