On the reliability evaluation, the phenomenon of surface roughness on the Al surface of DBA (Direct Brazed Aluminum) on power device is confirmed. This surface roughness is generated by cyclic thermal stress under thermal cycle test. In this study, the surface roughness characteristic after thermal cycle test is executed to DBA substrate and the generating mechanism was investigated. Furthermore, the effect on the fatigue life of solder joint on DBA substrate is also investigated.
Volume Subject Area:
Modeling and Simulation
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