This paper proposes the high reliable design method for lead-free solder joint on metal substrate on chip component. First, the crack propagation analysis method for estimating rupture life of solder joint was constructed. And then, the effect of material properties of insulating layer on metal substrate and solder joint shape for rupture life of solder joint was evaluated using crack propagation analysis. As the result, the relation between young’s modulus of insulating layer and rupture life was indicated quantitatively. Also, the relation of filet length for rupture life of solder joint was evaluated. Secondary, evaluation method of heat dissipation for metal substrate was proposed. Because thermal conductivity of insulating layer affects temperature rise of heating device. And, the relation between thermal conductivity of insulating layer and temperature rise of heating device was indicated.

Volume Subject Area:
Modeling and Simulation
Topics:
Lead-free solders, Metals, Reliability, Rupture, Solder joints, Crack propagation, Heating, Temperature, Thermal conductivity, Design methodology, Energy dissipation, Evaluation methods, Heat, Materials properties, Shapes, Young's modulus
This content is only available via PDF.
Copyright © 2011
 by ASME
You do not currently have access to this content.