The thermal and hydrodynamic performance of passive two-phase cooling devices such as heat pipes and vapor chambers is limited by the capabilities of the capillary wick structures employed. The desired characteristics of wick microstructures are high permeability, high wicking capability and large extended meniscus area that sustains thin-film evaporation. Choices of scale and porosity of wick structures lead to tradeoffs between the desired characteristics. In the present work, models are developed to predict the capillary pressure, permeability and thin-film evaporation rates of various micropillared geometries. Novel wicking geometries such as conical and pyramidal pillars on a surface are proposed which provide high permeability, good thermal contact with the substrate and large thin-film evaporation rates. A comparison between three different micropillared geometries — cylindrical, conical and pyramidal — is presented and compared to the performance of conventional sintered particle wicks. The present work demonstrates a basis for reverse-engineering wick microstructures that can provide superior performance in phase-change cooling devices.
Skip Nav Destination
ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
July 6–8, 2011
Portland, Oregon, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4461-8
PROCEEDINGS PAPER
Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders
Ram Ranjan,
Ram Ranjan
Purdue University, West Lafayette, IN
Search for other works by this author on:
Abhijeet Patel,
Abhijeet Patel
Purdue University, West Lafayette, IN
Search for other works by this author on:
Suresh V. Garimella,
Suresh V. Garimella
Purdue University, West Lafayette, IN
Search for other works by this author on:
Jayathi Y. Murthy
Jayathi Y. Murthy
Purdue University, West Lafayette, IN
Search for other works by this author on:
Ram Ranjan
Purdue University, West Lafayette, IN
Abhijeet Patel
Purdue University, West Lafayette, IN
Suresh V. Garimella
Purdue University, West Lafayette, IN
Jayathi Y. Murthy
Purdue University, West Lafayette, IN
Paper No:
IPACK2011-52041, pp. 131-142; 12 pages
Published Online:
February 14, 2012
Citation
Ranjan, R, Patel, A, Garimella, SV, & Murthy, JY. "Wicking and Thermal Characteristics of Micropillared Structures for Use in Passive Heat Spreaders." Proceedings of the ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1. Portland, Oregon, USA. July 6–8, 2011. pp. 131-142. ASME. https://doi.org/10.1115/IPACK2011-52041
Download citation file:
18
Views
Related Proceedings Papers
Related Articles
Advances in Fluid and Thermal Transport Property Analysis and Design of Sintered Porous Wick Microstructures
J. Heat Transfer (June,2013)
Effect of Wick Characteristics on the Thermal Performance of the Miniature Loop Heat Pipe
J. Heat Transfer (August,2009)
A Semi-Analytical Model to Predict the Capillary Limit of Heated Inclined Triangular Capillary Grooves
J. Heat Transfer (February,2002)
Related Chapters
Completing the Picture
Air Engines: The History, Science, and Reality of the Perfect Engine
Insulating Properties of W-Doped Ga2O3 Films Grown on Si Substrate for Low-K Applications
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Fans and Air Handling Systems
Thermal Management of Telecommunications Equipment