A thin-slab thermal storage volume that is sandwiched between a hand-held unit’s skin and a heat spreader that is in thermal contact with the electronics is analyzed. The storage volume is assumed to be filled with a conductivity enhanced, “dry” phase change material. Three storage volume configurations are considered. Configuration I is a single phase change material transitioning at one temperature. Configuration II is a two-layer system with phase change material-1 in thermal contact with the heat spreader and phase change material-2 in thermal contact with the unit’s skin. Configuration III consists of several layers, such that the phase transition temperature varies across the volume. A finite element model is built and numerical simulations provide temperature responses for each configuration. Results show that by employing a stratification of transition temperatures, relative to a non-stratified storage volume, up to a 20% decrease in recovery time is realized. Furthermore, utilization of two or more transition temperatures results in improved temperature control.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics Available to Purchase
Matt Yaquinto,
Matt Yaquinto
University of Nevada, Reno, Reno, NV
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Richard Wirtz
Richard Wirtz
University of Nevada, Reno, Reno, NV
Search for other works by this author on:
Matt Yaquinto
University of Nevada, Reno, Reno, NV
Richard Wirtz
University of Nevada, Reno, Reno, NV
Paper No:
InterPACK2009-89237, pp. 887-896; 10 pages
Published Online:
December 24, 2010
Citation
Yaquinto, M, & Wirtz, R. "Transition Temperature Stratified Thermal Energy Storage Systems Applied to On-Demand Cooling of High Power-Density Hand-Held Electronics." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 887-896. ASME. https://doi.org/10.1115/InterPACK2009-89237
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