A new methodology of cold plate and heat sink optimization is presented which can reduce the computational time by more than two orders of magnitude when compared to CFD. This methodology is intended for high Prandtl number fluids or fully developed velocity fields. When compared to CFD, this model can predict the heat transfer to within 8% of the CFD solution for the intended operating ranges. The paper outlines the manipulation of established empirical and analytical correlations for developing thermal fields with constant wall temperatures using a scaling analysis. Since the real fin temperature is not constant, the proposed technique utilizes superposition to recreate the real fin temperature profile and enable the use of established analytical models. Finally, the fins are not individually modeled, which is computationally intensive, but captured using an assumption of anisotropic conduction, where the convective heat transfer is converted to a volumetric sink term.
Skip Nav Destination
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
A New Methodology for Cold Plate and Heat Sink Optimization
Monem Alyaser
Monem Alyaser
Asetek USA, Inc., San Jose, CA
Search for other works by this author on:
Jeremy Rice
Asetek USA, Inc., San Jose, CA
Monem Alyaser
Asetek USA, Inc., San Jose, CA
Paper No:
InterPACK2009-89197, pp. 831-840; 10 pages
Published Online:
December 24, 2010
Citation
Rice, J, & Alyaser, M. "A New Methodology for Cold Plate and Heat Sink Optimization." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 831-840. ASME. https://doi.org/10.1115/InterPACK2009-89197
Download citation file:
10
Views
Related Articles
The Effect of Thermal Contact Resistance at Porous-Solid Interfaces in Finned Metal Foam Heat Sinks
J. Electron. Packag (December,2010)
Modeling Forced
Convection in Finned Metal Foam Heat Sinks
J. Electron. Packag (June,2009)
Numerical Study of Laminar Natural Convection Heat Transfer in Inclined Trapezoidal Enclosure
J. Thermal Sci. Eng. Appl (December,2019)
Related Chapters
Extended Surfaces
Thermal Management of Microelectronic Equipment
Extended Surfaces
Thermal Management of Microelectronic Equipment, Second Edition
When Is a Heat Sink Not a Heat Sink?
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong