This paper describes the facility level design of future water cooled supercomputers with an emphasis on the energy efficiency opportunities related to the use of water cooled economizer based facility cooling in lieu of traditional refrigeration chiller architectures. A hybrid cooled 80kW server rack with both air and water cooled components is considered for the analyses. In this system, 90% of the rack heat load is rejected directly to pumped water lines via CPU cold plates and conduction cooling and the remaining 10% rack power is rejected to the room ambient air and is subsequently transferred to the water loop via air to liquid heat exchanger based devices. Air to water heat exchangers are not included in the server racks. The facilities cost for water cooling of high power computer racks has been analyzed for data centers situated in two different geographic locations. The study takes into account both the energy savings resulting from the loop design as well as the duration of time for which these savings can be realized at the selected locations. Test data for the water cooled CPU modules is used to project the maximum chip junction temperature for different chilled water temperatures which are in turn determined using the outdoor air temperatures for different times of the year. After calculating the 5 year energy consumption savings over the traditional plant design for each location, for the two different geographic locations in the US considered, it was found that the outdoor weather permitted the use of the economizer based configuration for 53–76% and 60–80% of the time for A and B locations, respectively, yielding per rack energy related savings of $6–21k and $17–26k, respectively, for the thermal conditions considered.
Skip Nav Destination
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems Available to Purchase
Evan G. Colgan,
Evan G. Colgan
IBM T. J. Watson Research Center, Yorktown Heights, NY
Search for other works by this author on:
Madhusudan K. Iyengar
Madhusudan K. Iyengar
IBM Systems & Technology Group, Poughkeepsie, NY
Search for other works by this author on:
Evan G. Colgan
IBM T. J. Watson Research Center, Yorktown Heights, NY
Madhusudan K. Iyengar
IBM Systems & Technology Group, Poughkeepsie, NY
Paper No:
InterPACK2009-89177, pp. 799-806; 8 pages
Published Online:
December 24, 2010
Citation
Colgan, EG, & Iyengar, MK. "Facility Level Energy and Cost Analyses for Water Cooled Supercomputer Systems." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 799-806. ASME. https://doi.org/10.1115/InterPACK2009-89177
Download citation file:
9
Views
Related Proceedings Papers
Related Articles
Too Hot for Comfort
Mechanical Engineering (December,2006)
New Thermal Management Systems for Data Centers
J. Thermal Sci. Eng. Appl (September,2012)
Performance of a Residential-Sized GAX Absorption Chiller
J. Energy Resour. Technol (September,2001)
Related Chapters
System Thermal Analysis-Rack (Part II)
Thermal Management of Telecommunication Equipment, Second Edition
Completing the Picture
Air Engines: The History, Science, and Reality of the Perfect Engine
Resistance Mythology
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong