In the current study, a network-based resistor model has been developed for thermal analysis of a complex optoelectronic package called SFP (Small Form-factor Pluggable Device). This is done using the DELPHI (DEvelopment of Libraries of PHysical models for an Integrated design) Methodology. The SFP is an optical transceiver widely used in telecommunication equipments such as switches and routers. The package has a detailed construction, and typically has four heat generating sources. The detailed model for the SFP is constructed and validated using a natural convection experiment. The validated detailed model is used for generating the Boundary-Condition-Independent (BCI) Compact Thermal Model (CTM). Codes for solving the network topology and interfacing with the optimization subroutine were written using Matlab 7. The resulting CTM is extensively validated with multiple boundary condition sets. The CTM for the SFP shows maximum relative of errors less than 10% for the junction temperature on all of its active components and less than 20% for the heat flows through its sides for extreme set of boundary conditions.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages
Arun Prakash Raghupathy,
Arun Prakash Raghupathy
University of Cincinnati, Cincinnati, OH
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Attila Aranyosi,
Attila Aranyosi
Electronic Cooling Solutions Inc., Santa Clara, CA
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Urmila Ghia,
Urmila Ghia
University of Cincinnati, Cincinnati, OH
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Karman Ghia,
Karman Ghia
University of Cincinnati, Cincinnati, OH
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William Maltz
William Maltz
Electronic Cooling Solutions Inc., Santa Clara, CA
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Arun Prakash Raghupathy
University of Cincinnati, Cincinnati, OH
Attila Aranyosi
Electronic Cooling Solutions Inc., Santa Clara, CA
Urmila Ghia
University of Cincinnati, Cincinnati, OH
Karman Ghia
University of Cincinnati, Cincinnati, OH
William Maltz
Electronic Cooling Solutions Inc., Santa Clara, CA
Paper No:
InterPACK2009-89092, pp. 741-751; 11 pages
Published Online:
December 24, 2010
Citation
Raghupathy, AP, Aranyosi, A, Ghia, U, Ghia, K, & Maltz, W. "Development of Boundary Condition Independent Compact Thermal Models for Opto-Electronic Packages." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 741-751. ASME. https://doi.org/10.1115/InterPACK2009-89092
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