Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.
- Electronic and Photonic Packaging Division
Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages
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Oterkus, E, Agwai, A, Guven, I, & Madenci, E. "Peridynamic Theory for Simulation of Failure Mechanisms in Electronic Packages." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 63-68. ASME. https://doi.org/10.1115/InterPACK2009-89107
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