Adsorption cooling systems can be made compact enough to fit into electronic enclosures by the use of Thermo-Electric (TE) devices for heat regeneration and recovery. While such systems have been studied for near room temperature cooling of electronics, their straightforward application to harsh (high temperature) environments can prove detrimental to the TE devices. Cyclic temperature variations coupled with heat pump requirements can greatly reduce the performance of a TE device. Moreover the temperature overlap between adsorption and desorption processes, that is usually desired for greater heat recovery, increases the temperature variations that a TE device has to go through. Hence in the context of using TE device to regenerate and recover heat in between the adsorbent beds, it becomes important to balance the advantages and drawbacks of thermal overlap. In the present work the suitability of temperature overlap for thermoelectric assisted heat regeneration and recovery has been theoretically examined. It was found that greater temperature overlap in between adsorption and desorption processes is not beneficial for TE device assisted heat regeneration and recovery.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration
Ashish Sinha,
Ashish Sinha
Georgia Institute of Technology, Atlanta, GA
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Yogendra Joshi
Yogendra Joshi
Georgia Institute of Technology, Atlanta, GA
Search for other works by this author on:
Ashish Sinha
Georgia Institute of Technology, Atlanta, GA
Yogendra Joshi
Georgia Institute of Technology, Atlanta, GA
Paper No:
InterPACK2009-89021, pp. 625-633; 9 pages
Published Online:
December 24, 2010
Citation
Sinha, A, & Joshi, Y. "Thermoelectric Assisted Adsorption Cooling Systems for Harsh Environment Electronics: Issues With Heat Regeneration." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 625-633. ASME. https://doi.org/10.1115/InterPACK2009-89021
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