For a drastic energy conservation in data centers (more than 30%), a new advanced concept of thermal management systems of integrated cooling network in server racks is proposed, and a series of developmental studies toward the realization of the concept have been conducted. The concept consists of the following technological items: - Plug-in thermal network cables, - Narrow channel heat exchangers (single-phase and two-phase), - Thin flat-type heat pipes, - Development of nano-fluids for heat transfer enhancement. In this concept, CPUs in server racks are directly cooled with the aid of advanced 1.5 mm thick flat-type heat pipes or 3 mm thick narrow channel heat exchangers, though CPUs in server racks, at present, are cooled down with massive heat sinks by forced air flow in the racks. In the case of heat pipes, condensation regions are cooled by either single-phase or two-phase narrow channel heat sink instead of air-cooled finned heat sink. These cooling units are accommodated in server racks. In addition, plug-in thermal network cables, in which a working fluid for narrow channel heat exchangers is running, are integrated among server racks, and thermal energy dissipated in server racks are inclusively merged and managed by the thermal network cables. The working fluid heated up by the dissipated heat is recuperated in an outdoor cooling system. An attempt at the applications of silver nano-fluids as a working fluid in heat pipes and thermal network is also conducted in the present study. Silver nano-fluids are thermochemically synthesized by a microwave heating technique, which allows for superior stable suspension characteristics.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Advanced Integrated Cooling Systems for Thermal Management in Data Centers
Yoshiyuki Abe,
Yoshiyuki Abe
AIST - National Research Institute of Advanced Industrial Science & Technology, Tsukuba, Japan
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Masato Fukagaya,
Masato Fukagaya
SOHKi Co., Ltd., Nagoya, Japan
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Takashi Kitagawa,
Takashi Kitagawa
Kawamura Electric Inc., Seto, Japan
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Haruhiko Ohta,
Haruhiko Ohta
Kyushu University, Fukuoka, Japan
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Yasuhisa Shinmoto,
Yasuhisa Shinmoto
Kyushu University, Fukuoka, Japan
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Masahide Sato,
Masahide Sato
Utsunomiya University, Utsunomiya, Japan
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Ken-ichi Iimura
Ken-ichi Iimura
Utsunomiya University, Utsunomiya, Japan
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Yoshiyuki Abe
AIST - National Research Institute of Advanced Industrial Science & Technology, Tsukuba, Japan
Masato Fukagaya
SOHKi Co., Ltd., Nagoya, Japan
Takashi Kitagawa
Kawamura Electric Inc., Seto, Japan
Haruhiko Ohta
Kyushu University, Fukuoka, Japan
Yasuhisa Shinmoto
Kyushu University, Fukuoka, Japan
Masahide Sato
Utsunomiya University, Utsunomiya, Japan
Ken-ichi Iimura
Utsunomiya University, Utsunomiya, Japan
Paper No:
InterPACK2009-89009, pp. 619-624; 6 pages
Published Online:
December 24, 2010
Citation
Abe, Y, Fukagaya, M, Kitagawa, T, Ohta, H, Shinmoto, Y, Sato, M, & Iimura, K. "Advanced Integrated Cooling Systems for Thermal Management in Data Centers." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 619-624. ASME. https://doi.org/10.1115/InterPACK2009-89009
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