As the microelectronics industry continues to trend towards smaller, lighter, and higher power devices, thermal management is becoming more important than ever. Thermal interface materials (TIMs) play a crucial role in removing heat from both bare die and lidded packages. A serious challenge the industry has been facing is the lack of an agreed upon test standard that is specifically tailored for TIM thermal performance measurements between TIM suppliers and OEM customers. ASTM D 5470 is not necessarily the best gauge for TIMs in-application performance. Data generated by the OEM often differ from TIM supplier’s results, and thus can not be used confidently in thermal design. An OEM’s material selection can also prove to be unreliable when comparing data from different TIM suppliers. This paper presents a successful model that an OEM customer (Sun Microsystems) and a TIM supplier (LORD Corporation) have established for characterization of TIMs, and illustrates a package-level thermal test vehicle (TTV) setup for junction-to-sink thermal resistance measurements. Also presented are test results for several TIMs and repeatability of the test method. The effects of a few influencing factors, such as pressure load and TIM staging time, on the test results are also discussed.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Joint Development of a Package-Level Thermal Interface Material Test System Available to Purchase
Yanshu Susan Chen,
Yanshu Susan Chen
LORD Corporation, Cary, NC
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Stanley Pecavar,
Stanley Pecavar
Sun Microsystems, Inc., Santa Clara, CA
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Vadim Gektin
Vadim Gektin
Sun Microsystems, Inc., Santa Clara, CA
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Yanshu Susan Chen
LORD Corporation, Cary, NC
Stanley Pecavar
Sun Microsystems, Inc., Santa Clara, CA
Vadim Gektin
Sun Microsystems, Inc., Santa Clara, CA
Paper No:
InterPACK2009-89398, pp. 615-618; 4 pages
Published Online:
December 24, 2010
Citation
Chen, YS, Pecavar, S, & Gektin, V. "Joint Development of a Package-Level Thermal Interface Material Test System." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 615-618. ASME. https://doi.org/10.1115/InterPACK2009-89398
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