Two-phase microfluidic heat sinks promise high heat flux cooling at reduced pumping power compared to pumped liquid microchannel heat sinks. However, flow instabilities caused by bubble nucleation and expansion severely reduce heat transfer performance of two-phase microfluidic heat sinks. This study probes the governing physics of bubble nucleation and expansion by comparing the effects of pulsed heating to steady-state heating in a single microchannel. Pulsed heating at 8 Hz causes an increase in the average hotspot temperature of as much as 8°C compared to steady-state heating. Upstream and downstream temperature response does not vary significantly between heating conditions. The results correspond well with thin-film evaporation models for bubble growth. This study provides insight for designing two-phase microfluidic cooling system subjected to transient hotspots.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers Available to Purchase
Josef L. Miler,
Josef L. Miler
Stanford University, Stanford, CA
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Gamal Refai-Ahmed,
Gamal Refai-Ahmed
Advanced Micro Devices, Markham, ON, Canada
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Maxat Touzelbaev,
Maxat Touzelbaev
Advanced Micro Devices, Sunnyvale, CA
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Milnes David,
Milnes David
Stanford University, Stanford, CA
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Julie Steinbrenner,
Julie Steinbrenner
Stanford University, Stanford, CA
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Kenneth E. Goodson
Kenneth E. Goodson
Stanford University, Stanford, CA
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Josef L. Miler
Stanford University, Stanford, CA
Roger Flynn
Intel Corp., Chandler, AZ
Gamal Refai-Ahmed
Advanced Micro Devices, Markham, ON, Canada
Maxat Touzelbaev
Advanced Micro Devices, Sunnyvale, CA
Milnes David
Stanford University, Stanford, CA
Julie Steinbrenner
Stanford University, Stanford, CA
Kenneth E. Goodson
Stanford University, Stanford, CA
Paper No:
InterPACK2009-89325, pp. 563-569; 7 pages
Published Online:
December 24, 2010
Citation
Miler, JL, Flynn, R, Refai-Ahmed, G, Touzelbaev, M, David, M, Steinbrenner, J, & Goodson, KE. "Effects of Transient Heating on Two-Phase Flow Response in Microchannel Heat Exchangers." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 563-569. ASME. https://doi.org/10.1115/InterPACK2009-89325
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