In this study, the thermal simulations of 3 dimensional IC packages base on 4-layer vertical stacked die (bare die on bare die) with TSV (through silicon vias) and micro-bumps structure are conducted. The thermal models by finite volume method are developed for different geometrical parameters (TSV, micro-bumps distribution arrangement and spacer thickness) and material property (thermal conductivity of spacer). The thermal performance and the heat transfer mechanism for the stacked die package are analyzed for optimizing the geometrical and material parameters. Not only the temperature distributions but also the junction temperature and thermal resistances in 4-layer stacked die package with different multi-die power configurations are shown and discussed.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages Available to Purchase
Chih-Kuang Yu,
Chih-Kuang Yu
EOL/Industrial Technology Research Institute, Chutung, Taiwan
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Ming-Che Hsieh,
Ming-Che Hsieh
EOL/Industrial Technology Research Institute, Chutung, Taiwan
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Chun-Kai Liu,
Chun-Kai Liu
EOL/Industrial Technology Research Institute, Chutung, Taiwan
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Ming-Ji Dai,
Ming-Ji Dai
EOL/Industrial Technology Research Institute, Chutung, Taiwan
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Ra-Min Tain
Ra-Min Tain
EOL/Industrial Technology Research Institute, Chutung, Taiwan
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Chih-Kuang Yu
EOL/Industrial Technology Research Institute, Chutung, Taiwan
Ming-Che Hsieh
EOL/Industrial Technology Research Institute, Chutung, Taiwan
Chun-Kai Liu
EOL/Industrial Technology Research Institute, Chutung, Taiwan
Ming-Ji Dai
EOL/Industrial Technology Research Institute, Chutung, Taiwan
Ra-Min Tain
EOL/Industrial Technology Research Institute, Chutung, Taiwan
Paper No:
InterPACK2009-89242, pp. 507-512; 6 pages
Published Online:
December 24, 2010
Citation
Yu, C, Hsieh, M, Liu, C, Dai, M, & Tain, R. "The Numerical Study for the Thermal Characteristics of 3D Vertical Stacked Die Packages." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 507-512. ASME. https://doi.org/10.1115/InterPACK2009-89242
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