Critical fan performance metric such as characteristic output curves and maximum flow rates are affected by various environmental conditions where cooling fans are installed. This paper describes the relationship between the fan performance and configuration factors such as the flow inlet porosity of electronic enclosure, the flow obstacles which imitate high-density packages and narrow flow area configurations. We installed a test enclosure in front of a test fan and measured P-Q curves of the test fan, which were operated in the enclosure. The experiments, it was observed that the pressure difference was increased in the enclosure by the effects of a wall. We installed a perforated plate in front of the fan as an obstacle and investigated how this changed the P-Q curve. In general, addition of the perforated plate in front of the fan decreased the characteristic output of the fan. On the other hand, the flow rate by the fan supply was decreased by the existence of the narrow inlet or obstacles. When an opening area in front of a fan became smaller than double of the fan flow area, the flow rate was significantly decreased. In addition, it was observed that the maximum flow rate depended on the opening area ratio. Finally, a model for predicting flow rates decreases by the enclosure inlet and obstacles was proposed.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling
Takashi Fukue,
Takashi Fukue
Toyama Prefectural University, Imizu, Japan
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Katsuhiro Koizumi,
Katsuhiro Koizumi
COSEL Co., Ltd., Kamiakae, Toyama, Japan
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Masaru Ishizuka,
Masaru Ishizuka
Toyama Prefectural University, Imizu, Japan
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Shinji Nakagawa
Shinji Nakagawa
Toyama Prefectural University, Imizu, Japan
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Takashi Fukue
Toyama Prefectural University, Imizu, Japan
Katsuhiro Koizumi
COSEL Co., Ltd., Kamiakae, Toyama, Japan
Masaru Ishizuka
Toyama Prefectural University, Imizu, Japan
Shinji Nakagawa
Toyama Prefectural University, Imizu, Japan
Paper No:
InterPACK2009-89219, pp. 479-490; 12 pages
Published Online:
December 24, 2010
Citation
Fukue, T, Koizumi, K, Ishizuka, M, & Nakagawa, S. "Effect on Inlet Vent Porosity on Fan Characteristic Performance for Electronics Cooling." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 479-490. ASME. https://doi.org/10.1115/InterPACK2009-89219
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