This work focuses on deformation mechanisms taking place in a Printed Circuit Board (PCB) exposed to high impact shock. A combined experimental, theoretical, and numerical approach has been applied to address both the nature of the observed deformation and its modeling and test metrology implications. Experimental evidence overwhelmingly indicates that a PCB in both test and system applications undergoes nonlinear deformations. Geometric nonlinearity of board response is attributed to the elevated in-plane (membrane) stresses that develop when a drop height and/or inertia forces are significant. The impact of these stresses on deformations (board strain) was quantified using a specially designed test. Membrane stresses were also accounted for in a numerical (Finite Element Method) model developed and carefully validated in the course of this study. The model shows a very good agreement with test data. The nonlinearity of PCB deformation in shock, i.e. the fact that both bending moments and in-plane forces are present in the board has important implications on test metrology development and on correlation between the measured board strain and stresses in interconnects of surface mounted components. Of special importance is the impact that nonlinearity can have on development of transfer functions between strain measurements on system boards and strain measurements on test boards, which is also addressed in the paper.
Skip Nav Destination
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Nonlinear Response of a Printed Circuit Board in Shock Available to Purchase
G. Ramanathan,
G. Ramanathan
Intel Corporation, Folsom, CA
Search for other works by this author on:
W. Hezeltine,
W. Hezeltine
Intel Corporation, Hillsboro, OR
Search for other works by this author on:
K. Blue
K. Blue
Intel Corporation, Folsom, CA
Search for other works by this author on:
M. Vujosevic
Intel Corporation, Folsom, CA
P. Raghavan
Intel Corporation, Chandler, AZ
G. Ramanathan
Intel Corporation, Folsom, CA
W. Hezeltine
Intel Corporation, Hillsboro, OR
K. Blue
Intel Corporation, Folsom, CA
Paper No:
InterPACK2009-89094, pp. 45-54; 10 pages
Published Online:
December 24, 2010
Citation
Vujosevic, M, Raghavan, P, Ramanathan, G, Hezeltine, W, & Blue, K. "Nonlinear Response of a Printed Circuit Board in Shock." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 45-54. ASME. https://doi.org/10.1115/InterPACK2009-89094
Download citation file:
12
Views
Related Proceedings Papers
Related Articles
Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages
J. Electron. Packag (December,2007)
Visco-Elastohydrodynamic (VEHD) Lubrication in Radial Lip Seals: Part 1—Steady-State Dynamic Viscoelastic Seal Behavior
J. Tribol (October,1990)
A Review of Full Eulerian Methods for Fluid Structure Interaction Problems
J. Appl. Mech (January,2012)
Related Chapters
Fatigue Analysis in the Connecting Rod of MF285 Tractor by Finite Element Method
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Numerical Simulation of Spatial Synergic Interaction in the Double-Row Anti-Sliding Piles
Geological Engineering: Proceedings of the 1 st International Conference (ICGE 2007)