In the continuing effort to alleviate the increasing thermal loads for power electronics devices, numerous aggressive solutions have been developed, such as small-scale micro-channel heat exchangers. Although these methods can improve overall surface heat transfer to the order of 500 W cm−2, they are limited to single-sided cooling due to the typical wire-bonded electrical connections of the devices. Power overlay (POL) technology provides a stable planar structure for electrical connection, as well as attachment of an additional top-side heat exchanger. This study presents an analysis of double-sided microchannel cooling of a power electronics module. Two optimized, integral micro-channel heat sinks were attached above and below silicon power devices, with more traditional attachment on one side and a POL interface on the other. A compliant TIM was selected for low thermal resistance and good mechanical response, which allowed top-side connection to the POL surface. A theoretical model is presented that predicts the benefit of double-sided cooling based on the known performance of a single-sided heat sink and given addition thermal contact resistance for the top side. For microchannels with water, an enhancement of 26% was predicted. An experiment was also carried out to measure the actual performance benefit seen with double-sided cooling. An enhancement of over 30% was measured for a particular design. As the theory predicts, the benefit of double-sided cooling is limited for high performance designs. However, double-sided cooling could lead to high levels of thermal performance using low-performance technology.
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Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay
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Pautsch, AG, Gowda, A, Stevanovic, L, & Beaupre, R. "Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 427-436. ASME. https://doi.org/10.1115/InterPACK2009-89190
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