The cooling capability in compact electronic equipment in natural convective flow fields has been investigated. The relationship between air passage width in the channel and natural cooling capability was obtained. Temperature and velocity measurements were carried out using a channel model of electronic equipment comprising a vertical duct of rectangular section. The channel model had two copper walls and two transparent acrylic walls. The clearance between the copper walls was used as a parameter for the channel model. Velocity profiles of natural cooling flow in the channel were quantitatively measured using particle image velocimetry (PIV). The temperature and velocity results demonstrated that changes in the velocity profiles closely depend on the wall clearances. It is clarified that the clearance from 8 mm to 10 mm is the best size for natural cooling in the channel.
Skip Nav Destination
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment
Yasushi Nishino,
Yasushi Nishino
Toyama Prefectural University, Imizu, Japan
Search for other works by this author on:
Masaru Ishizuka,
Masaru Ishizuka
Toyama Prefectural University, Imizu, Japan
Search for other works by this author on:
Shinji Nakagawa
Shinji Nakagawa
Toyama Prefectural University, Imizu, Japan
Search for other works by this author on:
Yasushi Nishino
Toyama Prefectural University, Imizu, Japan
Masaru Ishizuka
Toyama Prefectural University, Imizu, Japan
Shinji Nakagawa
Toyama Prefectural University, Imizu, Japan
Paper No:
InterPACK2009-89103, pp. 341-346; 6 pages
Published Online:
December 24, 2010
Citation
Nishino, Y, Ishizuka, M, & Nakagawa, S. "Estimation of the Optimum Dimensions of a Vertical Channel Model for Natural Air Cooling in Electronic Equipment." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 341-346. ASME. https://doi.org/10.1115/InterPACK2009-89103
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Transport of Particulates in an Internal Cooling Ribbed Duct
J. Turbomach (October,2007)
Reversed Flow Structure and Heat Transfer Measurements for Buoyancy-Assisted Convection in a Heated Vertical Duct
J. Heat Transfer (November,1992)
Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs
J. Electron. Packag (December,2004)
Related Chapters
Fans and Air Handling Systems
Thermal Management of Telecommunications Equipment
Liquid Cooled Systems
Thermal Management of Telecommunications Equipment
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment