As the power dissipated by advanced microelectronic devices continues to increase, the demand for reliability also increases. This increases the requirements on the thermal performance of every part of the system, including the heat sink. One of the objectives of this study is to examine the effect of the shape of the heat sink fins on the thermal performance of the system. The pressure gradient at the center of the heat sink, near the base, tends to be high. This significantly reduces the airflow at that location and, hence, decreases transport in that region. Different fin shapes and airflow rates have been studied with the objective of searching for an optimal heat sink design that would improve the thermal performance without increasing the pressure drop across the heat sink. Parallel plate fins have been investigated by removing fin material from the region near the center of the heat sink along the length and height of the fins. The study also examines the impact of uniform and non-uniform heat sources in the device upon the overall system thermal performance. Twenty one heat sink designs with different cuts were simulated and compared and an improved heat sink design was proposed by eliminating the fin material at the center of the heat sink, thereby enhancing its thermal performance.
- Electronic and Photonic Packaging Division
Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes
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Gondipalli, S, Sammakia, B, & Refai-Ahmed, G. "Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 273-282. ASME. https://doi.org/10.1115/InterPACK2009-89076
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