The electrolytic capacitor is one of the most important components for the thermal analysis of electronic equipment. To predict component and system temperatures, the thermal flow simulation technique has been applied to thermal design in the development phase of electronic equipment. In this study, we examined a compact modeling method for electrolytic capacitors in order to simulate thermal flow based on the computational fluid dynamics (CFD) code. To obtain fundamental data for the thermal modeling method, first, we conducted experiments to identify the major thermal path of electrolytic capacitors in actual electronic equipment by using a switch mode power supply unit. Next, to verify the validity of the thermal model, a benchmark experiment was conducted to obtain actual measurement data of the temperature rise of electrolytic capacitors under various operating conditions. The thermal model of the electrolytic capacitor was presented based on the CFD code, which is a commercially available thermal flow simulation tool. In this paper, we describe in particular the snap-in type electrolytic capacitor.
Skip Nav Destination
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment Available to Purchase
Katsuhiro Koizumi,
Katsuhiro Koizumi
COSEL Co., Ltd., Kamiakae, Toyama, Japan
Search for other works by this author on:
Masaru Ishizuka,
Masaru Ishizuka
Toyama Prefectural University, Imizu, Toyama, Japan
Search for other works by this author on:
Shinji Nakagawa
Shinji Nakagawa
Toyama Prefectural University, Imizu, Toyama, Japan
Search for other works by this author on:
Katsuhiro Koizumi
COSEL Co., Ltd., Kamiakae, Toyama, Japan
Masaru Ishizuka
Toyama Prefectural University, Imizu, Toyama, Japan
Shinji Nakagawa
Toyama Prefectural University, Imizu, Toyama, Japan
Paper No:
InterPACK2009-89052, pp. 239-245; 7 pages
Published Online:
December 24, 2010
Citation
Koizumi, K, Ishizuka, M, & Nakagawa, S. "Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 239-245. ASME. https://doi.org/10.1115/InterPACK2009-89052
Download citation file:
7
Views
Related Proceedings Papers
Related Articles
A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model
J. Electron. Packag (December,2004)
Aerodynamic and Thermal Analysis of an Engine Cylinder Head Using Numerical Flow Simulation
J. Eng. Gas Turbines Power (July,1990)
Bolometric Response of High- T c Superconducting Detectors to Optical Pulses and Continuous Waves
J. Heat Transfer (May,1995)
Related Chapters
Introduction
Thermal Management of Microelectronic Equipment
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment
System Thermal Analysis-Rack (Part II)
Thermal Management of Telecommunication Equipment, Second Edition