For the past few years, nanoscale structures have been proposed and investigated experimentally for their enhanced thermoelectric properties over bulk materials. These structures offer several advantages: 1) increased local density of states, which can improve the Seebeck coefficient and 2) reduced thermal transport due to phonon confinement and increased scattering. Recently, nanocrystalline composites (NCC) have been examined for their ability to outperform the alloy limit in terms of reduced thermal conductivity. However, the electrical performance has not been examined from a quantum point of view. This work provides quantum simulations of a two-dimensional composite system meant to model certain geometric features of NCC’s. While the results cannot be quantitatively compared to actual measurements, they show how their electrical behavior differs from well-known superlattice devices. This work will aid in the design of the next generation of NCC devices for thermoelectric performance.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties
T. D. Musho,
T. D. Musho
Vanderbilt University, Nashville, TN
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D. G. Walker
D. G. Walker
Vanderbilt University, Nashville, TN
Search for other works by this author on:
T. D. Musho
Vanderbilt University, Nashville, TN
D. G. Walker
Vanderbilt University, Nashville, TN
Paper No:
InterPACK2009-89332, pp. 171-175; 5 pages
Published Online:
December 24, 2010
Citation
Musho, TD, & Walker, DG. "Quantum Simulation of Nanocrystalline Composite Thermoelectric Properties." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 171-175. ASME. https://doi.org/10.1115/InterPACK2009-89332
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