The thermal management of next-generation telecommunications equipment is becoming more challenging than ever before, thanks to the elevated ambient temperature requirements (up to 65°C) from network carriers, and the thermal limitation of critical components such as optical transceivers (with a max. rating of 85°C). With thousands of watts of heat dissipation from a single shelf, a systematic methodology has to be developed at the planning stage so that every possible means to streamline the thermal management can be integrated into the system-level design. This paper uses a next-generation fiber-optic telecom product as an example to demonstrate the impact of some major mechanical/electrical parameters (such as fan curve, acoustic noise, air filter, copper content of PCB and baffles, etc.) on the thermal performance of the system. Each factor is quantitatively analyzed based on field tests, and good design practices are suggested.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment
Lang Yuan,
Lang Yuan
Fujitsu Network Communications, Inc., Pearl River, NY
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Jignesh Patel
Jignesh Patel
Fujitsu Network Communications, Inc., Pearl River, NY
Search for other works by this author on:
Lang Yuan
Fujitsu Network Communications, Inc., Pearl River, NY
Jignesh Patel
Fujitsu Network Communications, Inc., Pearl River, NY
Paper No:
InterPACK2009-89377, pp. 1025-1032; 8 pages
Published Online:
December 24, 2010
Citation
Yuan, L, & Patel, J. "Major Considerations in System-Level Thermal Design of Next-Generation Telecommunications Equipment." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 1025-1032. ASME. https://doi.org/10.1115/InterPACK2009-89377
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