This paper presents the heat switch for electronic package to be operated at room temperature. The heat switch controls the thermal resistance between two objective plates using liquid pillar. By forming the liquid pillar, the temperature of the specific area can be controlled locally. In order to realize the desired switch operation, the heat switch should be provided with reservoir, switching channel and breathing channel. The channels are carefully designed to control the liquid pillar precisely. The liquid pillar formation depends on the liquid contact angle. The designed channel geometry can generate hydrophobic surface by using suddenly diverging shape like as capillary stop valve. Thus, the liquid pillar can be created at desired point with high stability. To verify the switch operation, the switch panel was designed and experiments were performed on a designed switch for the liquid pillar control and the heat flow regulation. The experiments show that the heat switch is able to work properly. Also, the temperature distribution and thermal resistance was changed in accordance with channel state as desired. As a result, the heat switch can be a good candidate of thermal management in the commercial electronics packages.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control Available to Purchase
Su-Heon Jeong,
Su-Heon Jeong
Gwang-ju Institute of Science and Technology, Gwang-ju, Republic of Korea
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Wataru Nakayama,
Wataru Nakayama
Therm Tech International, Kanagawa, Japan
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Sun-Kyu Lee
Sun-Kyu Lee
Gwang-ju Institute of Science and Technology, Gwang-ju, Republic of Korea
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Su-Heon Jeong
Gwang-ju Institute of Science and Technology, Gwang-ju, Republic of Korea
Wataru Nakayama
Therm Tech International, Kanagawa, Japan
Sun-Kyu Lee
Gwang-ju Institute of Science and Technology, Gwang-ju, Republic of Korea
Paper No:
InterPACK2009-89368, pp. 1021-1024; 4 pages
Published Online:
December 24, 2010
Citation
Jeong, S, Nakayama, W, & Lee, S. "Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 1021-1024. ASME. https://doi.org/10.1115/InterPACK2009-89368
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