Electronic devices have been developed with the transition of structures and materials. However, in the development, the miniaturization and the high integration of electronic device parts have been accorded priority over mechanical strength reliability. As a result, a lot of reliability issues have been exposed. Connective reliability issue which arises from warpage is one of the most important of them all in high integration electronic devices. To evaluate this warpage accurately, this paper focused on curing of resin materials which used in electronic devices during the thermal process. The deformation and the warpage behavior which arises from curing of resin materials were clarified by examinations. And the mechanism of the warpage of resin materials receiving the thermal loads was examined.

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