In this paper, the strain-rate dependent mechanical properties and stress-strain curve behavior of Sn3.8Ag0.7Cu (SAC387) solder is presented for a range of strain-rates at room temperature. The apparent elastic modulus, yield stress properties and stress-strain curve equation of the solder material is needed to facilitate finite element modeling work. Tensile tests on dog-bone shaped bulk solder specimens were conducted using a non-contact video extensometer system. Constant strain-rate uni-axial tensile tests were conducted over the strain-rates of 0.001, 0.01, 0.1 and 1 (s−1) at 25°C. The effects of strain-rate on the stress-strain behavior for lead-free Sn3.8Ag0.7Cu solder are presented. The tensile yield stress results were compared to equivalent yield stress values derived from nano-indentation hardness test results. Constitutive models based on the Ramberg-Osgood model and the Cowper-Symond model were fitted for the tensile test results to describe the elastic-plastic behavior of solder deformation behavior.

Volume Subject Area:
Reliability
Keywords:
Cowper-Symond model, lead-free solder, iso-strain-rate, Ramberg-Osgood model, strain-rate sensitivity, tensile test
Topics:
Lead-free solders, Solders, Yield stress, Stress-strain curves, Bone, Constitutive equations, Deformation, Elastic moduli, Finite element analysis, Mechanical properties, Modeling, Nanoindentation, Stress, Temperature
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 by ASME
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