In this paper, the strain-rate dependent mechanical properties and stress-strain curve behavior of Sn3.8Ag0.7Cu (SAC387) solder is presented for a range of strain-rates at room temperature. The apparent elastic modulus, yield stress properties and stress-strain curve equation of the solder material is needed to facilitate finite element modeling work. Tensile tests on dog-bone shaped bulk solder specimens were conducted using a non-contact video extensometer system. Constant strain-rate uni-axial tensile tests were conducted over the strain-rates of 0.001, 0.01, 0.1 and 1 (s−1) at 25°C. The effects of strain-rate on the stress-strain behavior for lead-free Sn3.8Ag0.7Cu solder are presented. The tensile yield stress results were compared to equivalent yield stress values derived from nano-indentation hardness test results. Constitutive models based on the Ramberg-Osgood model and the Cowper-Symond model were fitted for the tensile test results to describe the elastic-plastic behavior of solder deformation behavior.
- Electronic and Photonic Packaging Division
Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder
Tan, KE, & Pang, JHL. "Strain-Rate Effects on Constitutive Behavior of Sn3.8-Ag0.7-Cu Lead-Free Solder." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 841-847. ASME. https://doi.org/10.1115/InterPACK2009-89278
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