Current density levels are expected to increase by orders of magnitude in nanoelectronics. Electromigration which occur under high current density is the major concern for the nanoelectronics industry. Using a general purpose computational model, which is capable of simulating coupled electromigration and thermo-mechanical stress evolution, several dual damascene copper interconnect structures have been investigated for electromigration damage. Different diffusion boundary conditions including blocking and non blocking boundary conditions, current crowding effects, interface diffusion effects and material plasticity have been considered. Different damage criteria are used for quantifying material degradation. The computational simulation results match the experimental findings; therefore the model proves to be a useful tool for quantifying damage in nanoelectronics interconnects.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Electromigration Damage Mechanics of Interconnects Available to Purchase
Cemal Basaran,
Cemal Basaran
University at Buffalo, Buffalo, NY
Search for other works by this author on:
Minghui Lin
Minghui Lin
University at Buffalo, Buffalo, NY
Search for other works by this author on:
Cemal Basaran
University at Buffalo, Buffalo, NY
Minghui Lin
University at Buffalo, Buffalo, NY
Paper No:
InterPACK2009-89006, pp. 83-94; 12 pages
Published Online:
December 24, 2010
Citation
Basaran, C, & Lin, M. "Electromigration Damage Mechanics of Interconnects." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 83-94. ASME. https://doi.org/10.1115/InterPACK2009-89006
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