In this work, the effects of underfill cure temperature and JEDEC MSL preconditioning on underfill mechanical and strength properties, as well as flip chip assembly reliability have been explored. Baseline stress-strain curves, mechanical properties, and interfacial shear strengths of a capillary underfill were recorded for curing at 150 °C and 165 °C (30 minutes). In addition, the changes in the mechanical and strength properties resulting from MSL3 and MSL2 moisture preconditioning were evaluated. The MSL preconditioning of the underfill samples included the JEDEC specified humidity and temperature exposures, plus three simulated reflows at 245 °C or 260 °C. Thermal cycling life tests from −55 to 125 °C were also conducted on daisy chain flip chip assemblies incorporating the same underfill. The test matrix for the reliability testing included both 150 °C and 165 °C curing profiles, and two levels of precondition (none and MSL3). Finally, the failure mechanisms in the flip chip assemblies were studied using CSAM, x-ray and SEM analyses. The results clearly indicate the advantages of the higher curing temperature including improved mechanical properties, superior thermal cycling fatigue life, and enhanced resistance to detrimental effects from moisture exposure and solder reflow.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies
Jeffrey C. Suhling,
Jeffrey C. Suhling
Auburn University, Auburn, AL
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Pradeep Lall
Pradeep Lall
Auburn University, Auburn, AL
Search for other works by this author on:
Guoyun Tian
Auburn University, Auburn, AL
Chang Lin
Auburn University, Auburn, AL
Jeffrey C. Suhling
Auburn University, Auburn, AL
Pradeep Lall
Auburn University, Auburn, AL
Paper No:
InterPACK2009-89209, pp. 789-796; 8 pages
Published Online:
December 24, 2010
Citation
Tian, G, Lin, C, Suhling, JC, & Lall, P. "Cure Profile Effects on the Mechanical Behavior and Reliability of Flip Chip on Laminate Assemblies." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 789-796. ASME. https://doi.org/10.1115/InterPACK2009-89209
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