This paper presents the application of a new semi-empirical model for lifetime predictions. The model has been acquired by isothermal mechanical cycling testing using joint-scale solder samples on a novel testing apparatus. The calibrated model is here employed with an FEA model to predict the failure of a BGA device under thermal cycling. The modelling results show state-of-the-art agreement with the test data and superiority over Morrow model constants from literature that have been applied to this data set.

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