It has been widely accepted that solid state lighting, in terms of white light emitting diodes (LEDs), will be the fourth illumination sources due to their superior performance. In this study, an effective compact freeform lens design method for LED packaging was introduced. A compact silicone LED packaging lens with the refract index of 1.54 was designed for street lighting based on this method. Integrated with this small lens, a novel application-specific LED package, whose manufacturing process can be easily integrated into current LED packaging processes, was suggested. Two application-specific LED array modules, with the type of chip on board (CoB) package, were also designed by integrating 3×3 freeform silicone and polycarbonate (PC) lens arrays. Numerical simulation results demonstrated that the optical performances of these application-specific LED modules could directly meet the requirements of street lighting. By comparing with the traditional LED illumination module consisting of an LED and secondary optics, the novel application-specific LED packages have the advantages of low profile, small volume, high light output efficiency (LOE), low cost and convenience for customers to use, and they will probably become the trend of LED packages, providing more cost-effective solution to general lighting.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Novel Application-Specific LED Packages Integrated With Compact Freeform Lens
Kai Wang,
Kai Wang
Wuhan National Lab for Optoelectronics, Wuhan, China
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Fei Chen,
Fei Chen
Wuhan National Lab for Optoelectronics, Wuhan, China
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Zongyuan Liu,
Zongyuan Liu
Wuhan National Lab for Optoelectronics, Wuhan, China
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Xiaobing Luo,
Xiaobing Luo
Wuhan National Lab for Optoelectronics, Wuhan, China
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Sheng Liu
Sheng Liu
Wuhan National Lab for Optoelectronics, Wuhan, China
Search for other works by this author on:
Kai Wang
Wuhan National Lab for Optoelectronics, Wuhan, China
Fei Chen
Wuhan National Lab for Optoelectronics, Wuhan, China
Zongyuan Liu
Wuhan National Lab for Optoelectronics, Wuhan, China
Xiaobing Luo
Wuhan National Lab for Optoelectronics, Wuhan, China
Sheng Liu
Wuhan National Lab for Optoelectronics, Wuhan, China
Paper No:
InterPACK2009-89335, pp. 685-691; 7 pages
Published Online:
December 24, 2010
Citation
Wang, K, Chen, F, Liu, Z, Luo, X, & Liu, S. "Novel Application-Specific LED Packages Integrated With Compact Freeform Lens." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 685-691. ASME. https://doi.org/10.1115/InterPACK2009-89335
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