UV nanoimprint lithography (UV-NIL) is powerful tool of nano-fabrication. This process is simple and quickly pattern transfer method because of room temperature process. Now, in this process sometimes generates the errors about shortage of filling or volume shrinking by photo-curable process. Therefore, observation of UV photo-curable resin behaviors at curing process is important. To observe this phenomenon, micro digital-holographic particle-tracking velocimetry (micro-DHPTV) method was used. This measurement method has sub-micron three dimensional spatial resolutions and high time-resolution at Newton fluid. The UV photo-curable resin is low viscosity liquid and observation was carried out. In conclusion, curing process of UV photo-curable resin was observed by micro-DHPTV.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV Available to Purchase
Jun Taniguchi,
Jun Taniguchi
Tokyo University of Science, Noda, Chiba, Japan
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Shin-ichi Satake,
Shin-ichi Satake
Tokyo University of Science, Noda, Chiba, Japan
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Noriyuki Unno,
Noriyuki Unno
Tokyo University of Science, Noda, Chiba, Japan
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Takahiro Kanai
Takahiro Kanai
Tokyo University of Science, Noda, Chiba, Japan
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Jun Taniguchi
Tokyo University of Science, Noda, Chiba, Japan
Shin-ichi Satake
Tokyo University of Science, Noda, Chiba, Japan
Noriyuki Unno
Tokyo University of Science, Noda, Chiba, Japan
Takahiro Kanai
Tokyo University of Science, Noda, Chiba, Japan
Paper No:
InterPACK2009-89220, pp. 593-597; 5 pages
Published Online:
December 24, 2010
Citation
Taniguchi, J, Satake, S, Unno, N, & Kanai, T. "Observation of UV Nanoimprint Lithography Process by Micro-Digitalholographic-PTV." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 593-597. ASME. https://doi.org/10.1115/InterPACK2009-89220
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