We report finite volume simulations of the phonon Boltzmann transport equation (BTE) for heat conduction across the heterogeneous interfaces in SiGe superlattices. We employ the diffuse mismatch model with full details of phonon dispersion and polarization. Simulations are performed over a wide range of Knudsen numbers. Similar to previous studies we establish that thermal conductivity of a superlattice is much lower than the host materials for superlattice period in the submicron regime. Details of the non-equilibrium between optical and acoustic phonons that emerge due to the mismatch of phonon spectrum in silicon and germanium are delineated for the first time. Conditions are identified for which this can lead to a significant additional thermal resistance than that attributed primarily to boundary scattering of phonons. We report results for thermal conductivity for various volume fraction and superlattice periods.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces
Dhruv Singh,
Dhruv Singh
Purdue University, West Lafayette, IN
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Jayathi Y. Murthy,
Jayathi Y. Murthy
Purdue University, West Lafayette, IN
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Timothy S. Fisher
Timothy S. Fisher
Purdue University, West Lafayette, IN
Search for other works by this author on:
Dhruv Singh
Purdue University, West Lafayette, IN
Jayathi Y. Murthy
Purdue University, West Lafayette, IN
Timothy S. Fisher
Purdue University, West Lafayette, IN
Paper No:
InterPACK2009-89208, pp. 575-591; 17 pages
Published Online:
December 24, 2010
Citation
Singh, D, Murthy, JY, & Fisher, TS. "Effect of Phonon Dispersion on Thermal Conduction Across Si/Ge Interfaces." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 575-591. ASME. https://doi.org/10.1115/InterPACK2009-89208
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