This paper discusses a novel design for cooling microprocessors using micro fabricated water impinging jet on a hot surface in contact with an electronic device. The goal is to achieve enhanced heat transfer from the exposed surface, especially at localized “hot spot” regions, with minimum pressure drop to achieve the flow rate necessary. The proposed methodology is used to analyse cooling performance in our test structures, get temperature data, and extract heat transfer coefficient from the model. Based on this analysis with various design, optimisation of these design parameters will be studied to improve designs of liquid jet impingement for electronic cooling.

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