Although polymer-based materials are widely used in microelectronics packaging and viscoelasticity is an intrinsic characteristic of polymers, viscoelastic properties of polymeric materials are often ignored in package stress analyses due to the difficulty of measuring this property. However, it is necessary to consider the viscoelastic behavior when an accurate stress model is required. Viscoelastic properties of materials can be characterized either in the time domain or frequency domain. In this study, stress relaxation experiments were performed on a molding compound in the time domain. Prony series expansion was used to express the material’s relaxation behavior. Thermo-rheologically simple model was assumed to deduce the master curve of relaxation modulus using the time-temperature equivalence assumption. Two methods were compared to determine the Prony pairs and shift factor.
- Electronic and Photonic Packaging Division
Characterization of Viscoelasticity of Molding Compounds in Time Domain
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Chae, S, Zhao, J, Edwards, DR, & Ho, PS. "Characterization of Viscoelasticity of Molding Compounds in Time Domain." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 435-441. ASME. https://doi.org/10.1115/InterPACK2009-89388
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