Quad Flat No lead (QFN) packages are being used as alternative components to some of the large form-factor packages due to their smaller footprint, improved thermal and electrical performance. During the past few years, there has been a surge of published papers by end users and component manufacturers on the topic of assembly and reliability of the QFN packages. Both empirical and simulation data has been published, which has helped several manufacturers to develop design guidelines and assembly processes for these packages. There exists a gap in the current published work on the assembly and reliability of high I/O count QFNs on thick boards. In addition, reliability of the rework process on QFNs is not well documented. Therefore, objectives of this research were the following: • Evaluate the second level reliability in thermal cycling for reworked and non-reworked QFNs; • Evaluate the reliability of different sized QFNs on 125 mil thick boards and compare with existing literature; • Failure analysis and recommendations for reliability improvement; • Land pattern comparison; and • Rework process improvement. Studies have been conducted on different QFN packages between 32 pins and 164 pins on 125 mil thick boards with Organic Solder Preservative (OSP) surface finish. Experimental design includes the use of different package sizes, alternate thermal pad patterns, and use of tin-lead versus lead free processes. A subset of some of the package types has also been reworked using variations of the standard BGA rework processes to evaluate its reliability. All packages were daisy chained. Boards were subjected to thermal cycling test between 0 to 100 deg C for 6000 hours. Data is analyzed using Weibull distribution. Failure mechanisms have been analyzed using dye penetration tests and cross sections. The reliability results are discussed in terms of package construction, type of land patterns and rework. Recommendations for process improvement are delineated.
Skip Nav Destination
ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages
Salil Pradhan,
Salil Pradhan
Brocade Communications Systems, San Jose, CA
Search for other works by this author on:
Francois Billaut,
Francois Billaut
Brocade Communications Systems, San Jose, CA
Search for other works by this author on:
Sunil Gopakumar
Sunil Gopakumar
Brocade Communications Systems, San Jose, CA
Search for other works by this author on:
Salil Pradhan
Brocade Communications Systems, San Jose, CA
Francois Billaut
Brocade Communications Systems, San Jose, CA
Sunil Gopakumar
Brocade Communications Systems, San Jose, CA
Paper No:
InterPACK2009-89405, pp. 321-328; 8 pages
Published Online:
December 24, 2010
Citation
Pradhan, S, Billaut, F, & Gopakumar, S. "Assembly and Reliability Studies on Reworked and Non-Reworked QFN Packages." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 321-328. ASME. https://doi.org/10.1115/InterPACK2009-89405
Download citation file:
8
Views
Related Proceedings Papers
Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions
InterPACK2013
A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli
InterPACK2005
Related Articles
Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
J. Electron. Packag (December,2018)
Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
J. Electron. Packag (December,2005)
Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies
J. Electron. Packag (December,2006)
Related Chapters
Introduction
Managing Risks in Design & Construction Projects
Operations — The Players
Global Management Strategies: Sales, Design, Manufacturing & Operations (The Technical Manager's Survival Guides)
Data Base R&D for Unified Life Cycle Engineering
Computerization and Networking of Materials Data Bases