Electrohydrodynamic (EHD) printing has recently received considerable attention for its potential of high resolution printing. In typical EHD printing, at the constant flow rate condition, the electric field applied between the nozzle and the electrically conductive substrate induces cone jet, so that a droplet smaller than nozzle diameter can be ejected. However, for real application, fluid should be supplied to the nozzle by the constant pressure for multi-nozzle EHD. In this work, at the constant back pressure condition in the reservoir, EHD jetting phenomena were observed changing bias voltage. In addition, the onset voltage for EHD jetting was measured changing glass capillary nozzle diameter (outer diameter: 23, 42μm), hydrostatic back pressure head on the reservoir and the distance between the nozzle and the bottom electrode.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4359-8
PROCEEDINGS PAPER
An Experimental Study of Onset Condition for Electrohydrodynamic Jetting
Junyoung Song,
Junyoung Song
Korea University, Seoul, Korea
Search for other works by this author on:
Jaewon Chung
Jaewon Chung
Korea University, Seoul, Korea
Search for other works by this author on:
Hyojun Kim
Korea University, Seoul, Korea
Junyoung Song
Korea University, Seoul, Korea
Jaeik Jeong
Korea University, Seoul, Korea
Jaewon Chung
Korea University, Seoul, Korea
Paper No:
InterPACK2009-89387, pp. 183-186; 4 pages
Published Online:
December 24, 2010
Citation
Kim, H, Song, J, Jeong, J, & Chung, J. "An Experimental Study of Onset Condition for Electrohydrodynamic Jetting." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 183-186. ASME. https://doi.org/10.1115/InterPACK2009-89387
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