A methodology for modeling and simulating the electrothermal behavior of an enclosed electronic package is presented and validated. The electro-thermal model is constructed using system dynamics. The system model, in which the electrical and the thermal domain are combined, is presented. The developed model describes the dynamic thermal behavior system that was an electronic device in the test enclosure. An effective way to identify the thermal parameters of the system, especially the thermal contact resistance, is suggested. Based on the proposed model, either the variation of the heat source or the ambient temperature can be estimated. Simulated results were in good agreement with the measured temperature in the transient state accompanying with the variation of the environment.
- Electronic and Photonic Packaging Division
Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response
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Kim, J, Nakayama, W, & Lee, S. "Estimation of Thermal Parameters of the Compact Electronic Enclosure Using Dynamic Thermal Response." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 1. San Francisco, California, USA. July 19–23, 2009. pp. 103-111. ASME. https://doi.org/10.1115/InterPACK2009-89033
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