Ratchetting deformations of solder alloys are significant deformations for the safety and reliability of solder joints of electronic packaging. In this paper, the microstructural change of the solder alloys due to the uniaxial ratchetting deformation is evaluated to clarify the effect of the microstructure on the viscous deformation of solder alloys. The microstructures are observed after the specimens are subjected to the uniaxial ratchetting deformation during several cycle numbers. The change of the size of grains or lamella structures is used to evaluate the uniaxial ratchetting deformation of solder alloys. The observation clarifies that the differences in the microstructural change due to the uniaxial ratchetting deformation between the lead-free and lead-containing solder alloys. The uniaxial ratchetting deformation and the additional creep deformation after the ratchetting deformation is also simulated by the dislocation based constitutive model. The simulation suggests that the material parameters used in the constitutive model may be correlated to the microstructural change of the solder alloys.
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ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
July 8–12, 2007
Vancouver, British Columbia, Canada
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
0-7918-4278-9
PROCEEDINGS PAPER
Microstructural Change of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys Subjected to Uniaxial Ratchetting Deformation
Katsuhiko Sasaki,
Katsuhiko Sasaki
Hokkaido University, Sapporo, Hokkaido, Japan
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Takuji Kobayashi,
Takuji Kobayashi
Hokkaido University, Sapporo, Hokkaido, Japan
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Ken-Ichi Ohguchi
Ken-Ichi Ohguchi
Akita University, Akita, Japan
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Katsuhiko Sasaki
Hokkaido University, Sapporo, Hokkaido, Japan
Takuji Kobayashi
Hokkaido University, Sapporo, Hokkaido, Japan
Ken-Ichi Ohguchi
Akita University, Akita, Japan
Paper No:
IPACK2007-33603, pp. 99-105; 7 pages
Published Online:
January 8, 2010
Citation
Sasaki, K, Kobayashi, T, & Ohguchi, K. "Microstructural Change of Sn/37Pb and Sn/3Ag/0.5Cu Solder Alloys Subjected to Uniaxial Ratchetting Deformation." Proceedings of the ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASME 2007 InterPACK Conference, Volume 2. Vancouver, British Columbia, Canada. July 8–12, 2007. pp. 99-105. ASME. https://doi.org/10.1115/IPACK2007-33603
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